1/3 www.asb.co.kr may 2009 plerow tm ALN1733 internally matched lna module the plerow tm aln-series is the compactly designed surface-mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite communi- cation terminals, catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. specifications parameter unit min typ max frequency range mhz 1710 1755 gain db 26.5 27.5 gain flatness db 0.1 0.2 noise figure db 0.65 0.70 output ip3 dbm 39 40 s11 / s22 db -18 / -18 output p1db dbm 20 21 switching time (3) sec - supply current ma 160 180 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is -40 c to +85 c. 1) oip3 is measured with two tones at an output power of 7 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 3 rf in 8 rf out 10 vs others ground outline drawing (unit: mm) features s 21 = 27.6 db @ 1710 mhz = 27.4 db @ 1755 mhz nf of 0.65 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding considerations. 2. we recommend that the ground via holes be placed on the bottom of all ground pins fo r better rf and thermal performance, as shown in the drawing at the left side. description a ln1733 a sb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) website: www.asb.co.kr e-mail: sales@asb.co.kr tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4th fl. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea more information 2-stage single type specifications (in production) typ. @ t = 25 c, v s = 5 v, freq. = 1732.5 mhz, z o.sys = 50 ohm
2/3 www.asb.co.kr may 2009 plerow tm ALN1733 internally matched lna module s-parameters noise figure oip3 p1db 1710~1755 +5 v typical performance (measured) s-parameters & k factor
3/3 www.asb.co.kr may 2009 plerow tm ALN1733 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer?s dc supply status. the ca- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance. 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are in- cluded inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application frequency. application circuit recommended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi layer ceramic) capacitor 20~40 sec 260 c 200 c 150 c 60~180 sec ramp-up (3 ? c/sec) ramp-down (6 c/sec) in out vs size 25x25mm (for aln series ? 13x13mm) evaluation board layout
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